Alan Duncan, Lockheed Martin, Rick Kendrick, Lockheed Martin, Sam Thurman, Lockheed Martin, Danielle Wuchenich, Lockheed Martin, Ryan P. Scott, UC Davis, S. J. B. Yoo, UC Davis, Tiehui Su, UC Davis, Runxiang Yu, UC Davis, Chad Ogden, Lockheed Martin, Roberto Proietti, UC Davis
Keywords: imaging sensor, nanophotonics, CMOS, silicon chip, low SWAP, next generation, nanotechnology
Abstract:
The LM Advanced Technology Center and UC Davis are developing an Electro-Optical (EO) imaging sensor called SPIDER (Segmented Planar Imaging Detector for Electro-optical Reconnaissance) that provides a 10x to 100x size, weight, and power (SWaP) reduction alternative to the traditional bulky optical telescope and focal plane detector array. The substantial reductions in SWaP would reduce cost and/or provide higher resolution by enabling a larger aperture imager in a constrained volume. The SPIDER concept consists of thousands of direct detection white-light interferometers densely packed onto Photonic Integrated Circuits (PICs) to measure the amplitude and phase of the visibility function at spatial frequencies that span the full synthetic aperture. In other words, SPIDER would sample the object being imaged in the Fourier domain (i.e., spatial frequency domain), and then digitally reconstruct an image. The conventional approach for imaging interferometers requires complex mechanical delay lines to form the interference fringes. This results in designs that are not traceable to more than a few simultaneous spatial frequency measurements. SPIDER seeks to achieve this traceability by employing micron-=scale optical waveguides and nanophotonic structures fabricated on a PIC with micron-scale packing density to form the necessary interferometers. Prior LM IRAD and DARPA/NASA CRAD-funded SPIDER risk reduction experiments, design trades, and simulations have matured the SPIDER imager concept to a TRL 3 level. Current funding under the DARPA SPIDER Zoom program is maturing the underlying PIC technology for SPIDER to the TRL 4 level. This is done by developing and fabricating a second-generation PIC that is fully traceable to the multiple layers and low-power phase modulators required for higher-dimension waveguide arrays that are needed for higher field-of-view sensors. Our project also seeks to extend the SPIDER concept to add a zoom capability that would provide simultaneous low-resolution, large field-of-view and steerable high-resolution, narrow field-of-view imaging modes. A proof of concept demo is being designed to validate this capability. Finally, data collected by this project would be used to benchmark and increase the fidelity of our SPIDER image simulations and enhance our ability to predict the performance of existing and future SPIDER sensor design variations. These designs and their associated performance characteristics could then be evaluated as candidates for future mission opportunities to identify specific transition paths. This paper provides an overview of performance data on the first-generation PIC for SPIDER developed under DARPA SeeMe program funding. We provide a design description of the SPICER Zoom imaging sensor and the second-generation PIC (high- and low-resolution versions) currently under development on the DARPA SPIDER Zoom effort. Results of performance simulations and design trades are presented. Unique low-cost payload applications for future SSA missions are also discussed.
Date of Conference: September 15-18, 2015
Track: Optical Systems